Chemical vapor deposition (CVD) is a versatile technique used for depositing thin films and coatings with precise control and uniformity. This review explores the fundamentals, applications, advantages, limitations, recent advances, challenges, and future directions of CVD technology. Key topics include the types of CVD processes (thermal, plasma-enhanced, metal-organic, atomic layer deposition), materials deposited (metals, semiconductors, insulators, composites), and diverse applications ranging from microelectronics to biomedical devices. Technical challenges such as process control and materials compatibility, economic considerations, and environmental impacts are discussed. The review concludes with insights into future research areas aimed at enhancing CVD efficiency, expanding its material capabilities, and promoting sustainable practices.

Chemical Vapor Deposition, CVD, Thin Films, Coatings, Semiconductor Devices, Microelectronics, Nanotechnology, Biomedical Applications, Process Control, Materials Compatibility, Sustainability