Volume 20 No 10 (2022)
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Thermal and mechanical study of polymeric composites prepared from epoxy with copper filings
Maysam K. Jassem Al-Atrash and Ebtahag Z. Sulyman Al Halim
Abstract
Through this research, polymeric composites were prepared fromAddition of epoxy resin withCopper filings in certain weight ratios (0.5%,1%,1.5%,2%,2.5%,3%,4%,4.5%,5%) as a reinforcement material. The comparison was made between polymeric composites Before and after the cementing process,After a series of experiments, it was found that the best weight percentage was (4.5%),This addition was done at different temperatures (8,25,55)°C, The results when compared before and after the reinforcement process for the composites showed that the thermal conductivity the thermal conductivity increased after the strengthening process, for the mechanical properties, Impact test, Hardness and compressive strength, they increased at 25°C and increased at processing temperatures(8.55)°C, but less than at 25°C.
Keywords
Epoxy,Copper filings resin, Hardness strength, Compressivestrength, Impact strength, Thermal conductivity
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